HSIO Technology's ability to ability to combine high speed flex materials with traditional materials sets help create a best in class IC to fit your application.
LCP RIGID FLEX
This design allowed for a 100% LCP fabricated part to create one of the worlds' first 12 layer LCP rigid flex PCB. It enabled the customer to significantly reduce the size and layer count while creating a high speed network on impedance tuned circuits. This PCB can fit in the palm of your hand while delivering the performance of best in class mother board for a laptop.
LCP HYBRID RIGID FLEX
The circuit to the right uses 4 layers of LCP to create a network of circuits that can communicate a very fast speeds. We then can create an interconnect though the speed rigid material to meet the needs of the application.
HYBRID OF LCP AND OTHER STANDARD OR RF MATERIALS
The image to the right is an IC that utilizes a rigid high speed inner core while using LCP on the out layer to create a unquie IC operating environment.