RIGID FLEX

HSIO Technology's ability to ability to combine high speed flex materials with traditional materials sets help create a best in class IC to fit your application.

LCP RIGID FLEX

This design allowed for a 100% LCP fabricated part to create one of the worlds' first 12 layer LCP rigid flex PCB.  It enabled the customer to significantly reduce the size and layer count while creating a high speed network on impedance tuned circuits.  This PCB can fit in the palm of your hand while delivering the performance of best in class mother board for a laptop.

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LCP HYBRID RIGID FLEX

The circuit to the right uses 4 layers of LCP to create a network of circuits that can communicate a very fast speeds.  We then can create an interconnect though the speed rigid material to meet the needs of the application.

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HYBRID OF LCP AND OTHER STANDARD OR RF MATERIALS

The image to the right is an IC that utilizes a rigid high speed inner core while using LCP on the out layer to create a unquie IC operating environment.

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