HSIO Technologies uses a wide variety of commercially available materials. For more details see below.
COVERLAY AND SOLDER MASK MATERIALS
HSIO Technologies uses many different types of flex materials including but not limited to LCP, polyimide, Kapton and others upon request. Please use the button below to get more details about material specs if available.
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HSIO Technologies uses several types of bondply. The preferred material for construction is FL material. Click below for more information on this product.