FLEX BOARDS

HSIO Technologies MSAP and advanced print & etch capabilities allow for the reduction in circuit layers in a IC application.  Both of the these manufacturing building blocks also allow HSIO to control impedance controlled circuits beyond the typical 10% tolerance.

HDI ON FLEX

This flex was constructed on 12.5 micron polyimide with 18 micron lines and spaces.  Utilizing HSIO's advanced processing capabilities, we can produce circuits as small as 10 microns line and space.

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HDI TECHNOLOGY

This is an image of 18 microns lines and spaces using HSIO MSAP process on 12.5 micron flex material.

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