The company’s technology combines and refines core manufacturing building blocks selected from the Printed Circuit, Semiconductor Packaging, and Interconnect Device worlds and applies them to a variety of products that interconnect semiconductor devices. HSIO Technologies has created a set of design and manufacturing tools that bridge the gap between mainstream printed circuit geometries and those found in leading-edge semiconductor devices.
Our fabrication methodologies are highlighted by three fundamental capabilities:
Fine Line, High Density Printed Circuits
HSIO Technologies has developed a fine line, high density printed circuit capability that serves as an enabling technology for the Company's interconnect devices, and that may also be bundled as a small form-factor conventional PCB for use with HSIO Technologies' interconnect products. The company is currently working at 35 micron lines and spaces with 10 micron feature sizes, with a roadmap in place to 20 micron line and space with sub 10 micron feature sizes. The technology incorporates layer-to-layer planarization for optimal conductor cross-section, and allows for embedded passive features that enable multi-layer constructions with finely tuned impedance characteristics.
The Company's second core manufacturing building block is the capability to pattern and metallize very dense, high aspect ratio structures with feature sizes in the 10 micron range in high-performance liquid and dry film dielectric materials. This capability enables incorporation of a very broad range of contact shapes and sizes, as well as 2.5D/3D passive structures which complement those fabricated with traditional planar methods.
The Company's third core manufacturing building block is the laser-free fabrication of vias and other "z-dimension" conductor structures. This capability produces fully metallized, fine pitch blind and buried microvia structures that are combined with the Company's dielectric materials and processes to create features that enhance, refine, or tune interconnect device electrical performance.