High Performance Minimal Footprint Sockets for 0.35 + pitch devices. Industry Standard Spring Pins in a small footprint configuration
HSIO Technologies small outline sockets is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. HSIO can design a socket to work with any type IC packages; BGA- LGA – QFN- DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
Features and Benefits
Small Outline Footprint
The contact set footprint is nearly the same size as the device. The frame area is cantilevered over the target area allowing the same close decoupling around the device as in the end application.
Industry Standard Spring Pins
HSIO technologies has partnered with several Spring Pin manufactures so we can provide designs based on mechanical and electrical requirements, and cost points
The Bolt Down Lid (standard) is a simple way to push the device into the socket. Optional Sliding Lid or ½ turn Lid is also available for higher insertion applications.
Excellent Signal Performance
Depending on the electrical performance needed, the small outline spring pin sockets can be designed using the best type pin required for your electrical requirements.