Higher Insertion Count – with Sliding Lid
Near Zero PCB footprint
The Grypper Y socket footprint is only 1 mm larger than the DUT. Typically this footprint will fit into any end application allowing the Grypper Y socket to be directly reflowed into the same location as the device.
The Y shape results in a wiping action and less aggressive contact to the solder ball which allows multiple insertions of the same device. The removal force is extremely low at ~3 grams / contact.
The Sliding Lid is used to insert the device and assures excellent contact. The screw on the top released the press onto the device so the forces are controlled and balance to each application. Different materials can be design in the lid to act as a heat sink.
Excellent Signal Performance
The Short signal path and two points of contact, achieves low CRES and low insertion loss.