iMAPS 2016 Booth #54

Come Visit us again, at booth #54

March 15-17, 2016
WekoPa Resort and Casino, Fountain Hills, Arizona

The 12th Annual Device Packaging Conference (DPC 2016) will be held in Fountain Hills, Arizona, on March 15-17, 2016. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Find out more here

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