HSIO Technologies, LLC has announced it has reached an agreement in principle to acquire certain assets of R&D Interconnect Solutions from R&D Circuits Holdings, Inc. the parent company of R&D Circuits, Inc. The deal will be effective September 28, 2012.
R&D Interconnect Solutions (RDIS) produces high performance test sockets for engineering and ATE applications. Previously known as ‘Gryphics’, the group was acquired by R&D from Cascade Microtech in 2011. Under HSIO ownership the group will continue production, sales and support of all interconnect products and will also continue to develop new, innovative contact solutions.
Jim Russell, President of R&D Circuits, added “This move will allow us to focus on our next generation conductive elastomer interconnects. It also enables a partnership between R&D Circuits and HSIO Technologies to continue development and innovation of the Gryphics technologies.”
About R&D Circuits
A family-owned and operated business for over forty years, R&D Circuits has grown to five locations, with PWB manufacturing and assembly in South Plainfield, NJ and Allentown, PA; design engineering and sales services in Santa Clara, CA, Mesa, AZ, and Penang Malaysia. Technology solutions for the ATE industry include; fine pitch PWB fabrication down to 0.2mm, embedded component solutions for PWBs and daughter-cards, Conductive Bridge™ and Coaxial Via™ technologies, Elastech™ Condutive Elastomer interconnects and Test Sockets and Burn-in Board engineering and manufacturing services.
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About HSIO Technologies
HSIO Technologies is a privately held company that began operations in mid-2010 in Maple Grove, Minnesota, a suburb in the Northwest quadrant of the greater Twin Cities metropolitan area. The company is focused on developing high performance interconnect technologies to serve semiconductor device and electronics systems developers and manufacturers. The company has established an ISO 7 facility to provide for product and technology development, low volume / high mix manufacturing, and development of “build anywhere” production processes for seamless transfer to high-volume capable business partners as needed
For more information, please contact firstname.lastname@example.org or 763-447-6260