New R&D Facility: Maple Grove, Minnesota

HSIO Technologies, LLC, a provider of high performance interconnect solutions used in the testing of both bare die and packaged semiconductor devices, and in their integration into higher level products has moved into a 15,000 square foot research and development facility in the Northwest suburban Twin Cities metropolitan area of Maple Grove, MN.

HSIO Technologies Leadership

The company was created by the founder and former President of Gryphics, Inc., a privately held developer of high performance sockets used for testing of packaged semiconductor integrated circuits. HSIO Technologies’ principals bring together diverse backgrounds in interconnect test circuit technology, integrated circuit manufacturing, fine line printed circuit board fabrication and assembly, and technology integration for data storage and telecommunication applications.

 

Read more about HSIO Technologies’ Key Management Team

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