News

IMAPS 2017 Booth #12

Visit us at the IMAPS 13th International Conference and Exhibition on Device Packaging Booth #12 www.imaps.org/devicepackaging WekoPa Resort and Casino Fountain Hills, Arizona USA March 7-8, 2017

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iMAPS 2016 Booth #54

Come Visit us again, at booth #54 March 15-17, 2016 WekoPa Resort and Casino, Fountain Hills, Arizona The 12th Annual Device Packaging Conference (DPC 2016) will be held in Fountain Hills, Arizona, on March 15-17, 2016. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a […]

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HSIO Circuit Technologies Acquires former HEI Circuit Fabrication Operation

HSIO Circuit Technologies Acquires former HEI Circuit Fabrication Operation in Tempe, AZ   December 31 2015 – For General Release – HSIO Technologies, LLC headquartered in Maple Grove MN announces that on December 14, 2015 a wholly owned subsidiary HSIO Circuit Technologies, LLC acquired the former HEI Circuit Fabrication operation Cochlear Tempe, LLC in Tempe […]

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BiTS 2016

BiTS is the preeminent event for what’s Now & Next in the test of pack­aged integrated circuits (ICs). The technical pro­gram and exhibition is dedicated to providing a forum for the latest in­for­mation on a broad range of test topics in­clud­ing final, wafer sort, and burn-in. You will have many oppor­tu­ni­ties to meet, network, and explore ideas […]

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iMAPS 2015 Booth #808

Visit us at booth #808 October 27-29, 2015 Rosen Centre Hotel, Orlando the LARGEST Conference Program for Microelectronics, Assembly, 2.5/3D, Interconnect & Packaging THIS FALL: 3 Days, 29 Sessions, 5 Keynotes, 175 Speakers!! Find out more here

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