Introducing our

Standard Memory Catalogs for

the Grypper Family.

Find out more here

Interconnect Innovation

IC Sockets & Connectors

68QFN housing bottom view

Burn-In, HAST, Package Qualification, Bench Test/Characterization, System Level Test, ATE Production Test, First Silicon Validation, Prototype/Engineering Development


Fine Line PCBs

fine line PCB

35 micron lines and spaces with 10 micron feature size PCBs – precision molding, layer to layer 3-D interconnects, embedded electrical functions (transistors, capacitors, resistors, RFID, etc.)

Recent News

DesignCon 2015: Booth # 501

Sep 27, 2014

January 28 – 30, 2015
Santa Clara Convention Center, Santa Clara, CA
HSIO at DesignCon 2015

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Jim Rathburn talks with PCB007 Magazine about LCP PCB

Sep 27, 2014

Jim Rathburn, President and CEO of HSIO Technologies, sits down with PCB007 Magazine to discuss the company’s new LCP PCB process his company has developed.

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Introducing Standard Memory Catalogs

Jun 22, 2014

Learn about HSIO's products and the applications they work with in our Standard Memory Catalogs.

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See What's New at HSIO Tech

Dec 9, 2013

HSIO Technologies is excited to introduce our new products:

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Flash Memory Summit 2013: Booth #910

Jul 15, 2013

HSIO Technologies will be at Flash Memory Summit at booth # 910 displaying products and solutions available.

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