Burn-In, HAST, Package Qualification, Bench Test/Characterization, System Level Test, ATE Production Test, First Silicon Validation, Prototype/Engineering Development
35 micron lines and spaces with 10 micron feature size PCBs – precision molding, layer to layer 3-D interconnects, embedded electrical functions (transistors, capacitors, resistors, RFID, etc.)
610 S. Rockford Dr.
Tempe, AZ 85281
Jan 4, 2016Read More
Jan 4, 2016
HSIO Circuit Technologies Acquires former HEI Circuit Fabrication operation in Tempe, AZRead More
Oct 12, 2015Read More
Oct 12, 2015Read More
Dec 10, 2014
HSIO Technologies founder and President Jim Rathburn discusses Liquid Crystal Polymer(LCP) PCB technology that his company has developed has been publish by ISSUU - Modern Printed Circuits Magazine. -Read More
Nov 21, 2014Read More
Sep 27, 2014Read More
Sep 27, 2014
Jim Rathburn, President and CEO of HSIO Technologies, sits down with PCB007 Magazine to discuss the company’s new LCP PCB process his company has developed.Read More
Jun 22, 2014
Learn about HSIO's products and the applications they work with in our Standard Memory Catalogs.Read More
Dec 9, 2013
HSIO Technologies is excited to introduce our new products:Read More
Jul 15, 2013
HSIO Technologies will be at Flash Memory Summit at booth # 910 displaying products and solutions available.Read More
Jun 5, 2013Read More
HSIO Technologies applies advanced design concepts and manufacturing processes to enable interconnect solutions with ever smaller form factors and ever higher performance. The company has developed a patent-pending collection of technologies that eclipse performance and size limitations of traditional methods of electrical interconnect and power management. Combining traditional connector, chip packaging, and printed circuit manufacturing methods with processes used in the production of Photovoltaic, Display, LED, and Printed Electronics devices, the unique set of capabilities provide low cost, yet high performance methods to interconnect and power the components contained in electronic devices.
The technology tool set provides high density, small form factor interconnect devices featuring 35 micron lines and spaces and 10 micron feature sizes. The processes enable improved signal integrity, reduced cross-talk, and improved impedance matching by selectively fabricating structures which precisely tune the interconnect device's impedances to those of its operating environment. The company's uniquely integrated material set and fabrication techniques also provide a shorter design, prototyping, and production cycle time.
HSIO Technologies collaborates with electronics industry leaders to serve select applications within the Computing, Telecommunications, Mobile Device, Data Storage, Networking, and Consumer Electronics segments.
|Join HSIO at DesignCon 2016 in Santa Clara, Booth 1150.|
Join HSIO at BiTS 2016 in Mesa, Arizona