HSIO Technologies

HSIO Technologies applies advanced design concepts and manufacturing processes to enable interconnect solutions with ever smaller form factors and ever higher performance. The company has developed a patent-pending collection of technologies that eclipse performance and size limitations of traditional methods of electrical interconnect and power management. Combining traditional connector, chip packaging, and printed circuit manufacturing methods with processes used in the production of Photovoltaic, Display, LED, and Printed Electronics devices, the unique set of capabilities provide low cost, yet high performance methods to interconnect and power the components contained in electronic devices.

The technology tool set provides high density, small form factor interconnect devices featuring 35 micron lines and spaces and 10 micron feature sizes. The processes enable improved signal integrity, reduced cross-talk, and improved impedance matching by selectively fabricating structures which precisely tune the interconnect device's impedances to those of its operating environment.  The company's uniquely integrated material set and fabrication techniques also provide a shorter design, prototyping, and production cycle time.

HSIO Technologies collaborates with electronics industry leaders to serve select applications within the Computing, Telecommunications, Mobile Device, Data Storage, Networking, and Consumer Electronics segments.