Burn-In, HAST, Package Qualification, Bench Test/Characterization, System Level Test, ATE Production Test, First Silicon Validation, Prototype/Engineering Development
35 micron lines and spaces with 10 micron feature size PCBs – precision molding, layer to layer 3-D interconnects, embedded electrical functions (transistors, capacitors, resistors, RFID, etc.)
Dec 9, 2013
HSIO Technologies is excited to introduce our new products:Read More
Jul 15, 2013
HSIO Technologies will be at Flash Memory Summit at booth # 910 displaying products and solutions available.Read More
Jun 5, 2013Read More
HSIO Technologies applies advanced design concepts and manufacturing processes to enable interconnect solutions with ever smaller form factors and ever higher performance. The company has developed a patent-pending collection of technologies that eclipse performance and size limitations of traditional methods of electrical interconnect and power management. Combining traditional connector, chip packaging, and printed circuit manufacturing methods with processes used in the production of Photovoltaic, Display, LED, and Printed Electronics devices, the unique set of capabilities provide low cost, yet high performance methods to interconnect and power the components contained in electronic devices.
The technology tool set provides high density, small form factor interconnect devices featuring 35 micron lines and spaces and 10 micron feature sizes. The processes enable improved signal integrity, reduced cross-talk, and improved impedance matching by selectively fabricating structures which precisely tune the interconnect device's impedances to those of its operating environment. The company's uniquely integrated material set and fabrication techniques also provide a shorter design, prototyping, and production cycle time.
HSIO Technologies collaborates with electronics industry leaders to serve select applications within the Computing, Telecommunications, Mobile Device, Data Storage, Networking, and Consumer Electronics segments.