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Introducing our

Standard Memory Catalogs for

the Grypper Family.

Find out more here

Interconnect Innovation

IC Sockets & Connectors

68QFN housing bottom view

Burn-In, HAST, Package Qualification, Bench Test/Characterization, System Level Test, ATE Production Test, First Silicon Validation, Prototype/Engineering Development

 

Fine Line PCBs

fine line PCB

35 micron lines and spaces with 10 micron feature size PCBs – precision molding, layer to layer 3-D interconnects, embedded electrical functions (transistors, capacitors, resistors, RFID, etc.)

Recent News

Jim Rathburn's article about LCP PCB has been published ISSUU- Modern Printed Circuits

Dec 10, 2014

HSIO Technologies founder and President Jim Rathburn discusses Liquid Crystal Polymer(LCP) PCB technology that his company has developed has been publish by ISSUU - Modern Printed Circuits Magazine. -

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IPC APEX EXPO 2015: Booth #3402

Nov 21, 2014

February 22-26 , 2015
San Diego Conference Center, San Diego, CA
VISIT US AT BOOTH # 3402
HSIO at IPC APEX EXPO 2015

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DesignCon 2015: Booth # 501

Sep 27, 2014

January 28 – 30, 2015
Santa Clara Convention Center, Santa Clara, CA
VISIT US AT BOOTH # 501
HSIO at DesignCon 2015

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Jim Rathburn talks with PCB007 Magazine about LCP PCB

Sep 27, 2014

Jim Rathburn, President and CEO of HSIO Technologies, sits down with PCB007 Magazine to discuss the company’s new LCP PCB process his company has developed.

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Introducing Standard Memory Catalogs

Jun 22, 2014

Learn about HSIO's products and the applications they work with in our Standard Memory Catalogs.

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See What's New at HSIO Tech

Dec 9, 2013

HSIO Technologies is excited to introduce our new products:

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Flash Memory Summit 2013: Booth #910

Jul 15, 2013

HSIO Technologies will be at Flash Memory Summit at booth # 910 displaying products and solutions available.

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