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TOMORROW'S

TECHNOLOGY

TODAY

MORE ABOUT HSIO TECHNOLOGIES

Interconnect Innovation

IC Sockets & Connectors

68QFN housing bottom view

Burn-In, HAST, Package Qualification, Bench Test/Characterization, System Level Test, ATE Production Test, First Silicon Validation, Prototype/Engineering Development

 

Fine Line PCBs

fine line PCB

35 micron lines and spaces with 10 micron feature size PCBs – precision molding, layer to layer 3-D interconnects, embedded electrical functions (transistors, capacitors, resistors, RFID, etc.)

Recent News

See What's New at HSIO Tech

Dec 9, 2013

HSIO Technologies is excited to introduce our new products:

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Flash Memory Summit 2013: Booth #910

Jul 15, 2013

HSIO Technologies will be at Flash Memory Summit at booth # 910 displaying products and solutions available.

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